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Enclosure Design Guidelines

Parent Document: HARDWARE_OVERVIEW.md
Version: 0.1.0-draft

This document covers enclosure design, materials, manufacturing methods, and tamper-evident features for SimpleGo hardware.


Design Philosophy

Requirements by Tier

RequirementTier 1Tier 2Tier 3
ProtectionBasic drop/scratchIP54 splash resistantIP67 waterproof
Tamper EvidenceOptional stickersSerialized screwsCryptographic verification
Material3D printed plasticCNC aluminumPotted CNC aluminum
AssemblySnap-fit / screwsGasket + security screwsEpoxy sealed
Cost Target€5-15€80-150€150-300

Tier 1: 3D Printed Enclosure

Material Options

MaterialProsConsUse Case
PLAEasy to print, biodegradableBrittle, low heat resistancePrototypes
PETGStronger, better heat resistanceSlight stringingProduction DIY
ABSDurable, heat resistantWarping, requires enclosureHigher quality
ASAUV resistant, durableHarder to printOutdoor use

Recommendation: PETG for DIY production kits

Design Guidelines

┌─────────────────────────────────────────────────────────────┐
│ ENCLOSURE CROSS-SECTION │
├─────────────────────────────────────────────────────────────┤
│ │
│ Wall thickness: 2.0mm minimum │
│ ┌─────────────────────────────────────────────────┐ │
│ │ ▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓ │ │
│ │ ▓ ▓ │ │
│ │ ▓ ┌─────────────────────────────────────┐ ▓ │ │
│ │ ▓ │ PCB │ ▓ │ │
│ │ ▓ │ (with standoffs) │ ▓ │ │
│ │ ▓ └─────────────────────────────────────┘ ▓ │ │
│ │ ▓ ▓ │ │
│ │ ▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓ │ │
│ └─────────────────────────────────────────────────┘ │
│ │
│ PCB standoffs: 3mm height, M2.5 screw bosses │
│ Display cutout: +0.5mm tolerance │
│ Button cutouts: +0.3mm tolerance │
│ │
└─────────────────────────────────────────────────────────────┘

Snap-Fit Design

                    ┌───────────────┐
│ TOP SHELL │
│ │
Snap hook ──────┤► ┌─────┐ │
│ │ │◄───┼── Catch
│ └──┬──┘ │
│ │ │
└──────┼───────┘

┌──────┼───────┐
│ │ │
│ ┌──┴──┐ │
Catch ledge ────┤► │ │ │
│ └─────┘ │
│ │
│ BOTTOM SHELL │
└───────────────┘

Hook deflection: 0.5-1.0mm
Hook angle: 30-45°
Minimum 4 snaps for secure closure
Layer height:     0.2mm (0.12mm for fine details)
Infill: 20-30% (gyroid or grid)
Perimeters: 3 minimum
Top/bottom: 4 layers minimum
Supports: Minimize with design orientation
Print orientation: Largest flat surface on bed

Files to Provide

enclosures/tier1/
├── simplego_diy_top.stl
├── simplego_diy_bottom.stl
├── simplego_diy_buttons.stl # Optional button caps
├── simplego_diy.step # For modification
├── simplego_diy.f3d # Fusion 360 source
└── README.md # Print instructions

Tier 2: CNC Aluminum Enclosure

Material Selection

AlloyPropertiesUse Case
6061-T6Good machinability, anodizes wellStandard choice
6063-T5Better surface finishPremium appearance
7075-T6Highest strengthMaximum durability
5052Best corrosion resistanceMarine/outdoor

Recommendation: 6061-T6 for balance of cost, machinability, and strength

Design for CNC

┌─────────────────────────────────────────────────────────────────┐
│ CNC DESIGN GUIDELINES │
├─────────────────────────────────────────────────────────────────┤
│ │
│ WALL THICKNESS │
│ ───────────────── │
│ Minimum: 1.5mm (2.0mm recommended) │
│ Near features: 2.5mm minimum │
│ │
│ INTERNAL CORNERS │
│ ───────────────── │
│ Minimum radius: Tool diameter / 2 │
│ Recommended: R1.5mm for 3mm end mill │
│ │
│ BAD: GOOD: │
│ ┌────┐ ╭────╮ │
│ │ │ │ │ │
│ │ │ │ │ │
│ └────┘ ╰────╯ │
│ Sharp corner R1.5 radius │
│ │
│ POCKETS │
│ ───────────────── │
│ Maximum depth: 4× tool diameter │
│ Draft angle: 0° acceptable for CNC (not injection molding) │
│ │
│ THREADS │
│ ───────────────── │
│ Use threaded inserts (brass) for frequent assembly │
│ Direct threads: M3 minimum, 2× diameter depth │
│ │
└─────────────────────────────────────────────────────────────────┘

Gasket Design (IP54)

┌─────────────────────────────────────────────────────────────────┐
│ GASKET GROOVE │
├─────────────────────────────────────────────────────────────────┤
│ │
│ Cross-section: │
│ │
│ TOP SHELL │
│ ════════════════════ │
│ │ │
│ ┌──────┴──────┐ │
│ │ │ ← Gasket groove │
│ │ ○○○○○○○○○ │ ← O-ring or foam gasket │
│ │ │ │
│ └──────┬──────┘ │
│ │ │
│ ════════════════════ │
│ BOTTOM SHELL │
│ │
│ Groove dimensions for 2mm cord diameter O-ring: │
│ - Width: 2.5mm │
│ - Depth: 1.5mm │
│ - 25% compression when assembled │
│ │
│ Material: Silicone (temperature resistant) │
│ EPDM (chemical resistant) │
│ Neoprene (general purpose) │
│ │
└─────────────────────────────────────────────────────────────────┘

Surface Finish Options

FinishProcessAppearanceCost
As-machinedNoneTool marks visibleLowest
Bead blastedGlass bead mediaMatte, uniformLow
BrushedAbrasive beltDirectional linesMedium
AnodizedElectrochemicalColor options, durableMedium
Hard anodizedType III anodizingVery hard, dark grayHigh
CerakoteCeramic coatingCustom colors, tacticalHigh

Recommendation: Bead blast + Type II anodize (black or natural)

Security Screws

┌─────────────────────────────────────────────────────────────────┐
│ SECURITY SCREW OPTIONS │
├─────────────────────────────────────────────────────────────────┤
│ │
│ TAMPER-RESISTANT: │
│ │
│ Torx Pin Tri-Wing Snake Eye Spanner │
│ ╳ ✱ ⊙ ▬ │
│ (T10 pin) (Nintendo) (Custom) (Slot) │
│ │
│ SERIALIZED (Tier 2+): │
│ │
│ Custom screws with laser-engraved serial numbers │
│ Serial recorded in device OTP memory │
│ Visual inspection detects replacement │
│ │
│ RECOMMENDATION: │
│ Tier 2: Torx Pin (T10) + serialized heads │
│ Tier 3: Custom profile + serialized + epoxy │
│ │
└─────────────────────────────────────────────────────────────────┘

Manufacturing Sources

SupplierRegionMOQLead TimeNotes
PCBWay CNCChina17-14 daysGood for prototypes
XometryGlobal13-10 daysInstant quotes
ProtolabsUS/EU11-7 daysFastest turnaround
Local shopsLocal1VariesBest for iteration
FictivUS15-10 daysGood quality

Cost Estimate (Tier 2 enclosure):

  • Prototype (qty 1): €80-150
  • Small batch (qty 10): €40-80 each
  • Production (qty 100): €20-40 each

Tier 3: High-Security Enclosure

Potted Assembly

┌─────────────────────────────────────────────────────────────────┐
│ POTTED ENCLOSURE │
├─────────────────────────────────────────────────────────────────┤
│ │
│ Cross-section: │
│ │
│ ┌─────────────────────────────────────────────────────┐ │
│ │▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓│ │
│ │▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓│ │
│ │▓▓ ┌───────────────────────────────────────┐ ▓▓│ │
│ │▓▓ │ PCB │ ▓▓│ │
│ │▓▓ │ ┌─────┐ ┌─────┐ ┌─────┐ ┌─────┐ │ ▓▓│ │
│ │▓▓ │ │ MCU │ │ SE1 │ │ SE2 │ │ SE3 │ │ ▓▓│ │
│ │▓▓ │ └─────┘ └─────┘ └─────┘ └─────┘ │ ▓▓│ │
│ │▓▓ └───────────────────────────────────────┘ ▓▓│ │
│ │▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓│ │
│ │▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓▓│ │
│ └─────────────────────────────────────────────────────┘ │
│ │
│ ▓▓▓ = Aluminum-filled epoxy potting compound │
│ │
│ Properties: │
│ - Drilling creates conductive aluminum debris │
│ - Debris causes short circuits (tamper detection) │
│ - Thermal conductivity assists heat dissipation │
│ - Chemical resistance to common solvents │
│ │
└─────────────────────────────────────────────────────────────────┘

Potting Compounds

ProductTypeThermal ConductivityNotes
MG Chemicals 832TCEpoxy1.0 W/m·KGood balance
Loctite Stycast 2651Epoxy0.8 W/m·KIndustry standard
Custom (Al-filled)Epoxy1.5+ W/m·KMaximum security
Silicone (RTV)Silicone0.2 W/m·KReworkable (avoid)

Potting Process:

  1. Clean and dry PCB assembly
  2. Apply conformal coat to sensitive areas
  3. Place in enclosure mold
  4. Mix potting compound (observe pot life)
  5. Pour slowly to avoid air bubbles
  6. Vacuum degas if available
  7. Cure per manufacturer specs (typically 24h @ 25°C)

Active Tamper Mesh Wrap

┌─────────────────────────────────────────────────────────────────┐
│ FLEX PCB MESH WRAP │
├─────────────────────────────────────────────────────────────────┤
│ │
│ Flexible PCB wraps entire enclosure: │
│ │
│ ┌──────────────────────────────────────────────────────┐ │
│ │ ╔════════════════════════════════════════════════╗ │ │
│ │ ║░░░░░░░░░░░░░░░░░░░░░░░░░░░░░░░░░░░░░░░░░░░░░░░░║ │ │
│ │ ║░░ ┌──────────────────────────────────────┐ ░░║ │ │
│ │ ║░░ │ │ ░░║ │ │
│ │ ║░░ │ ALUMINUM ENCLOSURE │ ░░║ │ │
│ │ ║░░ │ │ ░░║ │ │
│ │ ║░░ │ (with potted PCB) │ ░░║ │ │
│ │ ║░░ │ │ ░░║ │ │
│ │ ║░░ └──────────────────────────────────────┘ ░░║ │ │
│ │ ║░░░░░░░░░░░░░░░░░░░░░░░░░░░░░░░░░░░░░░░░░░░░░░░░║ │ │
│ │ ╚════════════════════════════════════════════════╝ │ │
│ └──────────────────────────────────────────────────────┘ │
│ │
│ ░░░ = Flex PCB with continuous security mesh │
│ ═══ = Connection to internal tamper supervisor │
│ │
│ Flex PCB specifications: │
│ - Material: Polyimide (Kapton) │
│ - Thickness: 0.1mm │
│ - Copper: 18µm (0.5 oz) │
│ - Mesh trace: 0.1mm width, 0.2mm spacing │
│ - Wraps all 6 sides of enclosure │
│ │
└─────────────────────────────────────────────────────────────────┘

EMI Shielding (Optional)

For maximum security, add Faraday cage:

Construction options:

1. Conductive paint (internal)
- Nickel or copper-based paint
- Apply to internal surfaces
- Connect to ground

2. EMI gasket (at seams)
- Beryllium copper fingers
- Conductive foam
- Spiral wound gasket

3. Metal mesh (external)
- Fine copper or stainless mesh
- Soldered to ground
- Under outer shell

Effectiveness: >60dB attenuation at 1GHz

Tamper Evidence

Visual Indicators

┌─────────────────────────────────────────────────────────────────┐
│ TAMPER-EVIDENT FEATURES │
├─────────────────────────────────────────────────────────────────┤
│ │
│ 1. HOLOGRAPHIC SEALS │
│ ┌────────────────────┐ │
│ │ ✦ SIMPLEGO ✦ │ Serial number visible │
│ │ ══════════ │ Void pattern if removed │
│ │ SN: 00001234 │ Unique per device │
│ └────────────────────┘ │
│ │
│ 2. SERIALIZED SCREWS │
│ Laser-engraved serial on screw heads │
│ Recorded in device memory at manufacture │
│ Visual mismatch = tampering │
│ │
│ 3. ULTRASONIC WELDING (Tier 3) │
│ Plastic housing permanently bonded │
│ Cannot be opened without visible damage │
│ Used in combination with metal shell │
│ │
│ 4. GLITTER NAIL POLISH (DIY) │
│ Random glitter pattern over screw heads │
│ Photograph pattern at setup │
│ Compare before use │
│ │
└─────────────────────────────────────────────────────────────────┘

Cryptographic Verification (Tier 3)

┌─────────────────────────────────────────────────────────────────┐
│ CRYPTOGRAPHIC ENCLOSURE VERIFICATION │
├─────────────────────────────────────────────────────────────────┤
│ │
│ At manufacture: │
│ │
│ 1. Record in SE: │
│ - Screw serial numbers │
│ - Hologram serials │
│ - Enclosure serial │
│ - Hash of photo (optional) │
│ │
│ 2. Sign with device identity key │
│ │
│ At verification: │
│ │
│ 1. Device displays expected serials │
│ 2. User visually compares │
│ 3. Device confirms data is authentic (signed) │
│ 4. Any mismatch = potential tampering │
│ │
│ Cannot be forged without: │
│ - Access to identity private key (in SE) │
│ - Matching physical serials │
│ │
└─────────────────────────────────────────────────────────────────┘

Ergonomics and Usability

Handheld Form Factor

┌─────────────────────────────────────────────────────────────────┐
│ ERGONOMIC GUIDELINES │
├─────────────────────────────────────────────────────────────────┤
│ │
│ Dimensions (T-Deck style): │
│ Width: 110-130mm (comfortable grip) │
│ Height: 70-85mm │
│ Depth: 15-25mm │
│ │
│ Weight targets: │
│ Tier 1: <150g │
│ Tier 2: <250g │
│ Tier 3: <400g │
│ │
│ Features: │
│ - Rounded edges (R3mm minimum) │
│ - Textured grip areas │
│ - Lanyard attachment point │
│ - One-handed operation possible │
│ │
│ Hand grip zones: │
│ │
│ ┌─────────────────────────────────────┐ │
│ │ DISPLAY AREA │ │
│ │ │ │
│ ├─────────────────────────────────────┤ │
│ │░░░░│ KEYBOARD AREA │░░░░│ │
│ │░░░░│ │░░░░│ ░░ = Grip zones │
│ │░░░░│ │░░░░│ │
│ └─────────────────────────────────────┘ │
│ │
└─────────────────────────────────────────────────────────────────┘

Pager Form Factor

┌─────────────────────────────────────────────────────────────────┐
│ PAGER FORM FACTOR │
├─────────────────────────────────────────────────────────────────┤
│ │
│ Dimensions: │
│ Width: 60-80mm │
│ Height: 90-110mm │
│ Depth: 12-18mm │
│ │
│ Features: │
│ - Belt clip attachment │
│ - Lanyard hole │
│ - Minimal controls (encoder + 2-3 buttons) │
│ - E-Ink display (always visible) │
│ │
│ Front view: Side view: │
│ ┌───────────┐ ┌────┐ │
│ │ │ │ │ │
│ │ E-INK │ │ │ ← Belt clip │
│ │ DISPLAY │ │ │ │
│ │ │ │ │ │
│ ├───────────┤ │ │ │
│ │ ○ ◎ ○ │ └────┘ │
│ └───────────┘ │
│ Buttons Encoder │
│ │
└─────────────────────────────────────────────────────────────────┘

Thermal Management

Heat Dissipation

┌─────────────────────────────────────────────────────────────────┐
│ THERMAL DESIGN │
├─────────────────────────────────────────────────────────────────┤
│ │
│ Heat sources: │
│ - MCU: 0.3-0.8W (peak during crypto) │
│ - WiFi: 0.2-0.5W (during TX) │
│ - LoRa: 0.5-1.0W (during TX, if 1W PA) │
│ - Display: 0.1-0.3W (backlight) │
│ - Total peak: ~2-3W │
│ │
│ Thermal path: │
│ │
│ ┌─────────┐ │
│ │ MCU │ │
│ └────┬────┘ │
│ │ Thermal pad │
│ ▼ │
│ ┌─────────┐ │
│ │ PCB │ (2oz copper, thermal vias) │
│ └────┬────┘ │
│ │ Thermal interface material │
│ ▼ │
│ ┌─────────┐ │
│ │ ENCLOSURE│ (aluminum = heatsink) │
│ └────┬────┘ │
│ │ Convection │
│ ▼ │
│ AIR │
│ │
│ Design rules: │
│ - Place hot components near enclosure contact points │
│ - Use thermal vias under QFN/BGA (3×3 array minimum) │
│ - 0.5mm thermal pad between PCB and enclosure │
│ - Aluminum enclosure acts as heatsink (Tier 2+) │
│ │
└─────────────────────────────────────────────────────────────────┘

Connector and Port Placement

Standard Layout

┌─────────────────────────────────────────────────────────────────┐
│ PORT PLACEMENT │
├─────────────────────────────────────────────────────────────────┤
│ │
│ TOP VIEW: │
│ ┌─────────────────────────────────────┐ │
│ │ DISPLAY │ │
│ │ │ │
│ └─────────────────────────────────────┘ │
│ │
│ RIGHT SIDE: BOTTOM: LEFT SIDE: │
│ ┌───┐ ┌─────────┐ ┌───┐ │
│ │ │ │ │ │ │ │
│ │ ○ │ ← Power │ ▭ USB-C │ │ ○ │ ← Headphone │
│ │ │ button │ │ │ │ (optional) │
│ │ │ │ ▯ SD │ │ │ │
│ │ ○ │ ← Volume │ Card │ │ │ │
│ │ │ (optional) │ │ │ │ │
│ └───┘ └─────────┘ └───┘ │
│ │
│ USB-C on bottom: │
│ - Allows charging while standing │
│ - Cable doesn't interfere with grip │
│ - Access while in case/holster │
│ │
│ Avoid: │
│ - Ports on top (blocks display) │
│ - Ports on back (blocks grip) │
│ │
└─────────────────────────────────────────────────────────────────┘

Waterproofing Ports (IP67)

USB-C waterproofing options:

1. Port plug (included)
- Silicone plug attached by tether
- User removes to charge
- IP67 when inserted

2. Sealed magnetic connector
- Magnetic pogo pins
- Gasket around connector
- Always sealed

3. Wireless charging only
- No exposed ports
- Qi charging coil internal
- Maximum sealing

Bill of Materials (Enclosure)

Tier 1 BOM

ItemDescriptionSourceCost
Top shellPETG 3D printSelf/service€3-5
Bottom shellPETG 3D printSelf/service€3-5
ScrewsM2×8 Phillips (×4)Hardware store€1
InsertsM2 brass heat-set (×4)AliExpress€1
FeetSilicone bumpers (×4)Amazon€2
Total€10-14

Tier 2 BOM

ItemDescriptionSourceCost
Top shell6061-T6 CNCXometry/PCBWay€40-60
Bottom shell6061-T6 CNCXometry/PCBWay€40-60
AnodizingBlack Type IIIncluded-
GasketSilicone O-ringMcMaster-Carr€5
ScrewsTorx Pin M2.5×8 (×6)Security Fasteners€8
InsertsM2.5 brass threaded (×6)DigiKey€3
Tamper sealsHolographic (×2)Custom print€5
Total€101-141

Tier 3 BOM

ItemDescriptionSourceCost
Outer shell7075-T6 CNCProtolabs€80-120
Inner frame6061-T6 CNCProtolabs€40-60
Hard anodizeType IIIIncluded-
Flex mesh PCBCustom 6-side wrapPCBWay flex€30-50
Potting compoundAl-filled epoxy, 200gSpecialized€20
GasketsEPDM, multi-pointCustom€15
Security screwsCustom + serializedSpecialty€20
Tamper sealsCrypto-verifiedCustom€10
Total€215-295

File Deliverables

Complete Enclosure Package

enclosures/
├── tier1_diy/
│ ├── cad/
│ │ ├── simplego_diy.step # Universal CAD
│ │ ├── simplego_diy.f3d # Fusion 360
│ │ └── simplego_diy.FCStd # FreeCAD
│ ├── stl/
│ │ ├── top_shell.stl
│ │ ├── bottom_shell.stl
│ │ └── button_caps.stl
│ ├── drawings/
│ │ └── assembly.pdf
│ └── README.md

├── tier2_secure/
│ ├── cad/
│ │ ├── simplego_secure.step
│ │ └── simplego_secure.f3d
│ ├── drawings/
│ │ ├── top_shell_drawing.pdf
│ │ ├── bottom_shell_drawing.pdf
│ │ └── gasket_drawing.pdf
│ ├── manufacturing/
│ │ └── cnc_notes.md
│ └── README.md

├── tier3_vault/
│ ├── cad/
│ │ └── ... (NDA may apply)
│ ├── flex_pcb/
│ │ └── tamper_mesh_wrap.kicad_pcb
│ └── README.md

└── common/
├── hardware/
│ ├── screws.md
│ ├── inserts.md
│ └── gaskets.md
└── suppliers.md

Design Checklist

Before Manufacturing

  • PCB dimensions match enclosure cavity
  • Display cutout aligned with PCB
  • Button/switch cutouts correct size and position
  • USB-C port accessible
  • Antenna keepout area clear
  • Mounting holes align with PCB
  • Gasket groove dimensions correct
  • Thermal pad contact points defined
  • Assembly sequence documented
  • Tolerance analysis complete

For Security (Tier 2+)

  • Tamper seal locations defined
  • Screw serials can be recorded
  • Light sensor window designed
  • Mesh flex PCB fits
  • Potting volume calculated
  • No external probe points
  • EMI considerations addressed